| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device given an identification information being difficult to conduct a decoding, a forgery, a fabrication or the like and having a high safety, and to provide a manufacturing method for the semiconductor device. <P>SOLUTION: The semiconductor device 1 is given the identification information by using a plurality of bonding wires 3 electrically connecting semiconductor elements 5 and leads 2 for a wiring board. Each bonding wire 3 is used as one of identification elements having either form in a plurality of specified forms while constituting the identification information. The identification information is formed by the specified arrays or combinations of a plurality of the forms of the bonding wires 3. <P>COPYRIGHT: (C)2007,JPO&INPIT |
