WIRING BOARD FABRICATION METHOD, AND SOLDERING PASTE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board fabrication method and a soldering paste which ensure the reliable connection of an electronic component electrode terminal and a soldering ball for external connection. SOLUTION: This method fabricates a wiring board 15 with a solder layer 5 formed on a solder connection pad 3a on a surface of an insulating substrate 1 having a wiring conductor 2. This method comprises a step for applying a solder paste 30 composed of a solder powder 30a and a non-solder powder 30b with a melting point higher than and a gravity smaller than those of the solder powder 30a onto the solder connection pad 3a, a step for heating and melting the solder powder 30a in the solder paste 30 to form a melted solder layer 5a on the solder connection pad 3a and floating the non-solder powder 30b on the surface of the melted solder layer 5a, and a step for cooling and solidifying the melted solder layer 5a and removing the non-solder powder 30b from the solidified solder layer 5. COPYRIGHT: (C)2007,JPO&INPIT