SOLDERING METHOD USING GOLD TIN ALLOY SOLDER PASTE

摘要

PROBLEM TO BE SOLVED: To bond a substrate and a packaging component under a state free from residual flux without cleaning the component being mounted. SOLUTION: Reflow soldering method employing a gold tin alloy solder paste principally comprising gold tin alloy solder powder and flux is improved. The soldering method comprises a step 11 for supplying a predetermined amount of gold tin alloy solder paste to a solder bonding part of a substrate, a first melting step 13 for melting the solder powder contained in the paste and evaporating flux contained in the paste by holding the substrate supplied with the paste at a temperature exceeding the melting point of solder for a predetermined time, a step 15 for mounting a packaging component at the solder bonding part of the substrate supplied with the paste, and a second melting step 16 for bonding the substrate and the component through molten solder by holding the substrate mounting the packaging component at the reflow temperature. COPYRIGHT: (C)2007,JPO&INPIT