| 摘要 |
PROBLEM TO BE SOLVED: To accomplish a method and an apparatus for removing a foreign substance for a semiconductor device in which the foreign substance stuck on the semiconductor device can be efficiently removed without enlarging a facility. SOLUTION: A foreign substance is separated from a semiconductor device 20 by an exciting device 11, the opening of the semiconductor device 20 is covered by a sucking part 13 of a sucking device 12, a space 23 with a suction hole 13a and a communication hole 13b connected thereto is formed between the semiconductor device 20 and the sucking part 13, the inside of the space 23 is sucked by the sucking device 12 to introduce external air from the communication hole 13b into the space 23, an air current is generated from the communication hole 13b to the suction hole 13a, and the foreign substance blown up by the air current W can be sucked and removed. Thus, the foreign substance separated from the semiconductor device 20 is blown up only within the space 23 by the air current W sucked and removed so that there is no danger that the foreign substance is scattered around to contaminate a treatment apparatus or another clean semiconductor device. COPYRIGHT: (C)2007,JPO&INPIT
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