| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate surface-treating device and a substrate surface treatment method that can adjust the temperature of a substrate appropriately, can dry the substrate fully, and are highly reliable. SOLUTION: When etching an oxide film on the substrate W by hydrofluoric acid vapor, it is important that the temperature of the substrate W is adjusted appropriately. While the hydrofluoric acid vapor is being supplied to the surface of the substrate W, the temperature of the substrate W is adjusted appropriately as in the following. By supplying hot water into a back fluid supply pipe 26 via a valve 40d, the hot water is supplied toward the back of the substrate W held by a spin chuck 21 from a plurality of fluid flow outlets in a fluid umbrella nozzle 27. When the back of the substrate W is hydrophobic, a hot water layer HL made of the supplied hot water is generated between the back of the substrate W and the fluid umbrella nozzle 27. After the etching treatment, rinsing treating is made, and then the substrate W is dried by the high-speed rotation of the spin chuck 21. COPYRIGHT: (C)2007,JPO&INPIT
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