| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for preventing formation of any lump on a target, in particular, an indium tin oxide target in the sputtering process. SOLUTION: When coating a substrate by sputtering a coating material having a shape of a target 2, the target is cooled during the sputtering by means of a cooling medium fed at the target or past the region of the target or through the target, and the cooling medium has a feed temperature of less than 20°C. COPYRIGHT: (C)2007,JPO&INPIT
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