| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress the detachment of a core material in a wiring board of a semiconductor device. <P>SOLUTION: A multiple pattern substrate is cut in such a manner that the weaving direction of fiber 3j in each of two first core materials 3c of the multiple pattern substrate and the cutting direction of the substrate may form an acute angle, and the fiber 3j is exposed on end faces formed by this cutting operation. Since the weaving direction of the fiber 3j in each of the two first core materials 3c and the extending direction of the end faces form an acute angle, very fine fiber 3j can be woven into the first core materials 3c. Moreover, a resin 3m which is relatively vulnerable to stress can be less exposed, resulting in suppressing the detachment of the resin 3m on the cut planes. Since the weaving direction of the fiber 3j and the cutting direction of the substrate form an acute angle, progress of detachment can be suppressed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
