| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer substrate having decoupling function exerting an excellent decoupling function at low frequency and high frequency bands. <P>SOLUTION: The invention comprises a substrate body 100 mounting an IC component 200 connected with power/ground terminal portions on the upper surface of a multilayer substrate, a power line portion L10 formed on a power dielectric layer and connected with power terminal portions T10, T11, and T12 and the IC component 200, a ground line portion L20 formed on a ground dielectric layer and connected with the ground terminal portion and the IC component 200, a multilayer type chip capacitor mounted on the upper surface of the substrate body 100 and connected between the power terminal portions T10, T11, and T12 on the upper surface of the substrate body 100 and the ground terminal portions T20, T21, and T22, and a thin film capacitor built in the interior of the substrate body 100 and connected between the power line portion L10 and the ground line portion L20. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
