| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent an adhesiveness between a chip and a wire from lowering, an adhesiveness between the wire and an internal lead terminal from lowering, or a problem such as an etching of the chip from occurring by constituting the mark and the wire with the same material. <P>SOLUTION: A semiconductor device 1 is equipped with: a semiconductor chip 11 installed on an island 10, an internal lead terminal 12, a wire 13 for connecting the semiconductor chip 11 and the internal lead terminal 12, and a mark 14 which is described on the internal lead terminal 12 and shows information concerning the semiconductor device 1. In this place, the mark 14 consists of the same material as that of the wire 13. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
