| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method of manufacturing a semiconductor device capable of filling resin without forming a void when causing the resin to flow into a gap between a semiconductor chip and a TAB tape. SOLUTION: The manufacturing method of the semiconductor device includes a first step of causing one principal plane of the semiconductor chip 1 having a protruding electrode 2 to face one principal plane of the TAB tape 14, having a wire 4 for mechanically and electrically connecting the protruding electrode 2 with the corresponding wire 4; a second step of filling the resin 7 between the semiconductor chip 1 and the TAB tape 14; and a third step of sticking the semiconductor chip 1 to the TAB tape 14 by heat-curing the resin 7. When the resin 7 is filled during the second step, the semiconductor chip 1 and the TAB tape 14 are kept at a temperature ranging from a temperature with which viscosity of the resin 7 starts to drop to a heat-curing temperature in the third step. COPYRIGHT: (C)2007,JPO&INPIT
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