| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board in which an IC tip is directly electrically connected without using any lead component. <P>SOLUTION: The multilayer printed circuit board includes an IC chip 20 preliminary contained in a core substrate 30. The copper die pad 24 of the IC chip 20 has a transition layer 38 including a first thin film layer 33, a second thin film layer 36, and a thick film 37 disposed therein. Thus, the IC chip and the printed circuit board is electrically connected without using any lead component or sealing resin. The transition layer 38 including a multiple layer is formed on the die pad 24 to improve the connection or reliability between the die pad 24 and a via hole 60. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
