发明名称 PATTERN CORRECTION METHOD AND PATTERN CORRECTION DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a pattern correction method and a pattern correction device capable of laminating the deposition layer of a correction liquid on a defective part without heating. <P>SOLUTION: In the pattern correction device 1, ultraviolet rayαis radiated to a defective part 13a of an electrode 13 formed on a substrate 14 from an ultraviolet ray irradiator 6 while the mist of ultraviolet curable correction liquid 20 is jetted to the defective part 13a from a coating nozzle 30, so that fine particles of correction material are deposited on the defective part 13a to form a deposition layer 33. So, no application nozzle 30 is clogged due to setting of the correction 20 at the tip of the coating nozzle 30 under radiant heat from the heated defective part 13a or the like. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007227021(A) 申请公布日期 2007.09.06
申请号 JP20060044173 申请日期 2006.02.21
申请人 NTN CORP 发明人 KOIKE TAKASHI;SHIMIZU SHIGEO
分类号 H01J9/50;H01J11/02;H01J11/22;H01J11/34;H01J11/36 主分类号 H01J9/50
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