| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board and a manufacturing method thereof, in which an inner via hole is filled completely. SOLUTION: The board can comprise: a core layer in which the inner via hole is formed; a first plating layer that closes one entrance of the inner via hole, leaving a remaining space in the inner via hole unfilled; and a second plating layer that closes the other entrance of the inner via hole, filling the remaining space. An asymmetrical current density is applied to both sides of the core layer. One surface of the inner via hole is connected preferentially. A problem occurs when a method of applying a uniform current density to both sides is applied. When an inner center section is connected firstly, by filling the inner via hole with plating, an agitating characteristic at the center of the hole is lowered suddenly, and a non-filled region (Void) is produced. COPYRIGHT: (C)2007,JPO&INPIT |
