发明名称 ILLUMINATION ASSEMBLY AND METHOD OF MAKING SAME
摘要 <p>An illumination assembly including a thermally conductive substrate, a patterned conductive layer proximate a major surface of the thermally conductive substrate, a dielectric layer positioned between the patterned conductive layer and the major surface of the substrate, and at least one LED including a post that is attached to the major surface of the thermally conductive substrate is disclosed. The at least one LED can be thermally connected to the thermally conductive substrate through the post and electrically connected to the patterned conductive layer. The dielectric layer can be reflective.</p>
申请公布号 EP1829124(A2) 申请公布日期 2007.09.05
申请号 EP20050825491 申请日期 2005.11.23
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 OUDERKIRK, ANDREW J.;TRAN, HUNG T.;SCHULTZ, JOHN C.;WHEATLEY, JOHN A.;SCHENKE, KAY-UWE;MEIS, MICHAEL A.;POJAR, STEPHEN J.;LEHNHARDT, WOLFGANG N.
分类号 H01L33/60;H01L33/64 主分类号 H01L33/60
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