| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can be visually inspected easily. <P>SOLUTION: The semiconductor device 101 is provided with a semiconductor substrate 103. In the peripheral area of the backside 105 of the semiconductor substrate 103, a step 107 is provided. The step 107 works to perform irregular reflections of laser beams used by a visual inspection device. Therefore, if the semiconductor device 101 with a mirror-like backside is mounted on a packaging board, visual inspection can be easily performed by enhancing differences between the luminous intensity of laser beams reflected by the semiconductor device 101 and that of laser beams reflected by the packaging board. <P>COPYRIGHT: (C)2004,JPO |
