| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate processing device which is capable of effectively protecting a holding arm against damages without enlarging the substrate holder in size. SOLUTION: A substrate holder 1 which holds semiconductor wafers collectively is equipped with three holding arms 2a, 2b, and 2c, that are each provided with holding grooves 4 where the peripheral edges of semiconductor wafers W are inserted from the above and a support 3 which supports the three holding arms 2a, 2b, and 2c in a cantilever manner. A groove 5 is provided to each of the holding arms 2a, 2b and 2c at a position between the support 3 and one from among the holding grooves 4 located nearest the support 3 so as to prevent stresses from concentrating at a position corresponding to the holding groove 4 located nearest the support 3.</p> |
