SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE HANDLING METHOD

摘要

An apparatus for processing a substrate is provided to prevent a layer formed on a substrate or a device formed in the substrate from being broken by controlling or preventing induced charging of the substrate. A carrier for receiving a substrate(W) is supported by a carrier support part. A substrate support unit supports the substrate when a predetermined treatment is performed on the substrate. A substrate transfer unit transfers the substrate between the carrier supported by the carrier support part and the substrate support unit. The substrate support unit includes a first substrate contact member in contact with a corresponding substrate in supporting the substrate. A conductive part is included in at least the substrate contact part of the first substrate contact member such that the conductive part is grounded. A third substrate contact member can come in contact with the substrate received in the carrier supported by the carrier support part. The conductive part is included in at least the substrate contact part of the third substrate contact member such that the conductive part is grounded.