One embodiment of the present application includes a multisensor assembly. This assembly has an electromechanical motion sensor member defined with one wafer layer, a first sensor carried with a first one or two or more other wafer layers, and a second sensor carried with a second one of the other wafer layers. The one wafer layer is positioned between the other wafer layers to correspondingly enclose the sensor member within a cavity of the assembly.
申请公布号
EP1828048(A1)
申请公布日期
2007.09.05
申请号
EP20050823700
申请日期
2005.12.06
申请人
KONINKLIJKE PHILIPS ELECTRONICS N.V.
发明人
O'MAHONY, PADRAIG;CARIS, FRANK;KERSJES, THEO;PAQUET, CHRISTIAN