| 摘要 |
A cleaning apparatus is provided to minimize an increase of a footprint even if the diameter of a scrub cleaning unit is extended, by stacking a plurality of scrub cleaning units that used to be two-dimensionally buried. A substrate(W) is almost horizontally maintained by a spin chuck which rotates the substrate within the surface of the spin chuck. A brush comes in contact with the upper surface of the substrate maintained by the spin chuck to perform a scrub cleaning process. The brush is maintained by a brush maintenance arm. The brush maintenance arm is driven by an arm driving unit. A process liquid supplying unit includes first and second process liquid discharge nozzles that discharge process liquid to the substrate maintained by the spin chuck. The process liquid from the first process liquid discharge nozzle is discharged toward the center of the substrate. The process liquid from the second process liquid discharge nozzle is discharged toward a predetermined position outside the center of the substrate. While the brush transfers over the substrate and comes in contact with the upper surface of the substrate, a controller controls the supply timing of the process liquid from the first process liquid discharge nozzle so that the process liquid discharged toward the center of the substrate doesn't correspond to the brush.
|
