发明名称 |
Method of exposing a wafer to a light, and reticle, reticle assembly and exposing apparatus for performing the same |
摘要 |
A method of exposing a wafer to a light comprises transferring an image onto a plurality of shot areas by irradiating a projection light, each of the plurality of shot areas including at least one die area defined on the wafer on which a photoresist film is formed, and scanning the at least one die area adjacent to an edge portion of the wafer by irradiating a scanning light.
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申请公布号 |
US7265818(B2) |
申请公布日期 |
2007.09.04 |
申请号 |
US20040023231 |
申请日期 |
2004.12.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK BYONG-CHEOL;SHIN DONG-HWA;CHAE SEUNG-KI;LEE SANG-HO |
分类号 |
G03B27/32;G03F7/20;G03B27/42;G03F1/00;H01L21/027 |
主分类号 |
G03B27/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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