发明名称 Method of exposing a wafer to a light, and reticle, reticle assembly and exposing apparatus for performing the same
摘要 A method of exposing a wafer to a light comprises transferring an image onto a plurality of shot areas by irradiating a projection light, each of the plurality of shot areas including at least one die area defined on the wafer on which a photoresist film is formed, and scanning the at least one die area adjacent to an edge portion of the wafer by irradiating a scanning light.
申请公布号 US7265818(B2) 申请公布日期 2007.09.04
申请号 US20040023231 申请日期 2004.12.27
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK BYONG-CHEOL;SHIN DONG-HWA;CHAE SEUNG-KI;LEE SANG-HO
分类号 G03B27/32;G03F7/20;G03B27/42;G03F1/00;H01L21/027 主分类号 G03B27/32
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