发明名称 |
Methods for monitoring a chemical mechanical planarization process of a metal layer using an in-situ eddy current measuring system |
摘要 |
Methods are provided for monitoring a CMP process. An exemplary method comprises generating a plurality of thickness measurements of a metal layer using an in-situ eddy current measuring system. The thickness measurements are analyzed to derive a plurality of work piece metrics and the work piece metrics are assessed to determine if a predetermined number is within a predetermined specification. A signal is generated if the predetermined number of the work piece metrics is outside the predetermined specification.
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申请公布号 |
US7264537(B1) |
申请公布日期 |
2007.09.04 |
申请号 |
US20060499443 |
申请日期 |
2006.08.04 |
申请人 |
NOVELLUS SYSTEMS, INC. |
发明人 |
LAURSEN THOMAS;KASPRZYK KARL;REYNOLDS STEVEN;FRANZEN PAUL;QUARANTELLO JUSTIN |
分类号 |
B24B49/12 |
主分类号 |
B24B49/12 |
代理机构 |
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代理人 |
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地址 |
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