发明名称 Heat dissipation device for electronic equipment
摘要 A heat sink is attached to fixing plates of a shield case. When a circuit board is covered by the shield case, the heat sink comes into contact with a circuit component mounted on the circuit board through a heat conduction sheet. Further, clearance holes, which are approximately closed by first heat dissipation plates, are formed to the shield case.
申请公布号 US7265984(B2) 申请公布日期 2007.09.04
申请号 US20060357973 申请日期 2006.02.22
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NUMATA TAKEHIKO
分类号 H05K7/20;H05K9/00 主分类号 H05K7/20
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