| 摘要 |
<p>Disclosed is a heat-resistant resin which can be applied to various functional materials. Such a heat-resistance resin has low elastic modulus and low stress while keeping cohesive force and reliability even at high temperatures. Specifically disclosed is a thermoplastic resin having an elastic modulus of not more than 1 GPa at room temperature of 250C and an elastic modulus of not less than 1 MPa at 2500C, or a precursor resin thereof.</p> |
