| 摘要 |
A method for attaching an adhesive tape to a semiconductor wafer and an apparatus using the same are provided to attach uniformly the adhesive tape to the semiconductor wafer without applying inappropriate tension by using a controller for controlling a forced transfer amount of a forced tape transfer unit. A holding and supporting table holds and supports a semiconductor wafer(W). An adhesive tape supply unit(6) supplies an adhesive tape(T) to a surface of the semiconductor wafer which is held and supported by the holding and supporting table. An attaching unit(8) attaches the adhesive tape on the surface of the semiconductor wafer by pressing the adhesive tape with an attaching roller(23). A roller position detection unit detects a movement position of the attaching roller. A forced tape transfer unit transfers the adhesive tape toward the attaching unit. A controller(37) changes a forced transfer amount of the forced tape transfer unit with a preset characteristic corresponding to the detected roller position. |
