| 摘要 |
Disclosed is a multilayer printed circuit board wherein a copper foil is thermally compression bonded onto an insulating layer in which a bump for interlayer connection is buried, and the copper foil and the bump are electrically connected with each other. The copper foil is provided with an oxide film having a thickness of 50-350 Å on the side which is in contact with the bump and insulating layer. In the production process, for example, an oxide coating of the copper foil to be thermally compression bonded is removed by acid cleaning, and then an oxide film having an appropriate thickness is formed by irradiating the copper foil with ultraviolet light. Consequently, reliability in electrical connection between the copper foil and the bump is adequately secured, while achieving sufficient mechanical connection strength between the copper foil and the insulating layer. |
