发明名称 MOUNTING STRUCTURE OF COOLING MODULE FOR BUS
摘要 A mounting structure of a cooling module for a bus is provided to improve durability of a radiator and an intercooler by preventing vibration of a cooling fan and an engine from being directly transferred to the radiator, and to be easily assembled by previously mounting the cooling module before being mounted on a car body. A mounting structure of a cooling module for a bus comprises an engine frame(60), a pulley assembly(70), a radiator(80) and an intercooler(90). The engine frame is formed to support an engine. The pulley assembly is coupled to the engine frame, and receives power of the engine so as to be driven. The radiator is located to be opposite to the pulley assembly, and coupled to the engine frame. The intercooler is located to be opposite to the radiator, and coupled to the engine frame.
申请公布号 KR20070084658(A) 申请公布日期 2007.08.27
申请号 KR20060016747 申请日期 2006.02.21
申请人 HYUNDAI MOTOR COMPANY 发明人 JUNG, HEE JONG
分类号 B60H1/32;B60H1/00;B60K11/00 主分类号 B60H1/32
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