| 摘要 |
<p>A conductive pattern forming apparatus using electrostatic force, by which high productivity, application to a large area and pattern change availability are achieved, without limiting a substrate nor increasing extra steps of plating and the like, with easy steps, lower cost, shorter manufacturing time and less environmental load. The conductive pattern forming apparatus is provided with an electrostatic latent image forming means for forming an electrostatic pattern on a dielectric thin film surface, and a developing means for forming the conductive pattern by development by supplying a conductive particle dispersed solution to the electrostatic latent image and bringing the solution into contact with the electrostatic latent image. The conductive particle dispersed solution is provided by dispersing conductive particles, which have ionic organic molecules adsorbed on the surface and a particle diameter of 100nm or less, in a nonpolar solvent.</p> |
