COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING METHOD

摘要

A component mounting apparatus (2) is provided with a stage (41) which has its height position fixed and holds a substrate (5), and a mounting head (48) which releasably holds the chip (2), brings down the chip from a first reference height position (HB1) fixed on an upper part of the stage (41) toward the stage (41), and mounts the chip (2) on the substrate (5) or on the mounted chip (2). A control apparatus (14) is provided with a mounting reference height calculating section (103) for calculating a mounting reference height (Hn) which corresponds to a distance from the first reference height position (HB1), and a first target moving height calculating section (104) for calculating a target moving height (ZTAGn) based on at least the mounting reference height (Hn) and the thickness (PTn) of the chip (2) held by the mounting head (48), and mounts the chip (2) on the substrate (5) or on the mounted chip (2) by bringing down the mounting head (48) from the first reference height position (HB 1) to the target moving height (ZTAGn).