发明名称 PRINTED WIRING BOARD
摘要 A printed wiring board wherein insulating layers and conductor circuits are alternately stacked and each conductor circuit has a rectangular cross section. In the printed wiring board, the relationship between an interval between the adjacent conductor circuits and a thickness (T) of the conductor circuit satisfies inequalities of 0.10T<=|W1-W2|<= 0.73T, where W1 is an interval on a conductor circuit upper side and W2 is an interval on a conductor circuit lower plane side. Thus, even when an IC to be driven at a high speed is mounted, cross talk and signal delay are suppressed and IC malfunction can be prevented.
申请公布号 KR20070086941(A) 申请公布日期 2007.08.27
申请号 KR20077015386 申请日期 2005.12.15
申请人 IBIDEN CO., LTD. 发明人 NAKAI TORU;TAMAKI MASANORI
分类号 H05K3/46 主分类号 H05K3/46
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