发明名称 USE OF CL2 AND/OR HCL DURING SILICON EPITAXIAL FILM FORMATION
摘要 In a first aspect, a first method of forming an epitaxial film on a substrate is provided. The first method includes (a) providing a substrate; (b) exposing the substrate to at least a silicon source so as to form an epitaxial film on at least a portion of the substrate; and (c) exposing the substrate to HC1 and C12 so as to etch the epitaxial film and other films formed during step (b). Numerous other aspects are provided.
申请公布号 KR20070086438(A) 申请公布日期 2007.08.27
申请号 KR20077013924 申请日期 2005.11.30
申请人 APPLIED MATERIALS INC. 发明人 YE ZHIYUAN;KIM, YI HWAN;LI XIAOWEI;ZOJAJI ALI;DALIDA NICHOLAS C.;TANG JINSONG;CHEN XIAO;SAMOILOV ARKADII V.
分类号 H01L21/20 主分类号 H01L21/20
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