| 摘要 |
An apparatus and a method for connecting a high-performance circuit board are provided to obtain compact and high-performance connections between circuit boards by using a vertical column device. A first circuit(12) has a first major face having a first signal contact(36) connected to a signal trace. A second circuit device(16) has a second major face forming a second signal contact(66). The second major face is in parallel with the first major face and faces the first major face. The second signal contact corresponds to the first signal contact. A vertical column device(42) is provided between the first and the second signal contacts. The vertical device has an axis(44), an internal conductor(52), and a shield(56). The axis is vertically arranged with respect to the first and the second major faces. The internal conductor is electrically connected to the first and the second signal contacts. The shield encloses the internal conductor and is electrically insulated from the internal conductor. |
