PACKAGE ON PACKAGE SUBSTRATE AND THE MANUFACTURING METHOD THEREOF

摘要

A package on package substrate and its manufacturing method are provided to reduce a thickness of the package on a package substrate and to extend a space between a top package and a bottom package by forming a metal bump and a cavity on a bottom package substrate. A top package substrate(2) is laminated on an upper portion of a bottom package substrate(1). A solder ball(3) is coupled to a lower surface of the top package substrate. A metal bump(20) is protruded from the upper surface of the bottom package substrate. The metal bump corresponds to a position of the solder ball. A cavity is recessed from the upper surface of the bottom package substrate, corresponding to a position where an electronic device(4) is mounted. A bonding pad is formed on a position corresponding to an electrical point of contact of the electronic device. The metal bump is formed in a body with the bottom package substrate.