| 发明名称 |
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
An opening is made in a resin (20) with a laser to form a viahole. A copper foil (22) etched into a thin film (3 mum) to lower the heat conductivity is used as a conformal mask, thereby making an opening (20a) in the resin (20) by fewer times of irradiation with a pulse laser beam. This prevents formation of any undercut in the resin (20) on which an interlayer resin-insulating layer is to be formed, enabling improvement in the connection reliability of the viahole. |
| 申请公布号 |
KR20070086864(A) |
申请公布日期 |
2007.08.27 |
| 申请号 |
KR20077015087 |
申请日期 |
2007.06.29 |
| 申请人 |
IBIDEN CO., LTD. |
发明人 |
HIROSE NAOHIRO;NODA KOUTA;SEGAWA HIROSHI;EN HONJIN;TSUKADA KIYOTAKA;ISHIDA NAOTO;ASANO KOUJI;SHOUDA ATSUSHI |
| 分类号 |
H05K3/42;B23K26/38;H05K1/02;H05K3/00;H05K3/10;H05K3/18;H05K3/28;H05K3/38;H05K3/46 |
主分类号 |
H05K3/42 |
| 代理机构 |
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