APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE CAPABLE OF POTTING THERMOSETTING RESIN WHILE BEING HEATED

摘要

An apparatus and a method for manufacturing a semiconductor package capable of potting a thermosetting resin while being heated are provided to improve reliability and to reduce a manufacturing cost. A resin potting unit pots a thermosetting resin to a gap between a semiconductor chip(1) and a TAB(Tape-Automated Bonding) tape(3) during the semiconductor chip and the TAB tape are heated. The resin potting unit includes a resin potting stage(11') and a resin potting nozzle. The resin potting stage mounts the semiconductor chip and the TAB tape and has a heater(11'a) for heating the semiconductor chip and the TAB tape. The resin potting nozzle pots the thermosetting resin to the gap.