| 摘要 |
<p>A radiation-sensitive composition comprising 1 to 80 wt.% of solid components and 20 to 99 wt.% of solvent. The solid components contain compound (B) of 400 to 2000 molecular weight (b) having the structure resulting from introduction of an acid-dissociable functional group in at least one phenolic hydroxyl of polyphenol compound (A) synthesized by a condensation reaction between a C12-C36 bi-to tetravalent aromatic ketone or aromatic aldehyde (a) and a C6-C15 compound having 1 to 3 phenolic hydroxyls. The composition containing this compound (B) is useful as an acid-amplified nonpolymeric resist material, because it is highly sensitive to radiation, such as KrF excimer laser, extreme ultraviolet, electron beam or X-ray, and is capable of forming a resist pattern of high resolution, high heat resistance and high etching resistance.</p> |
