| 摘要 |
<p>A laser beam machining method capable of accurately cutting particularly a laminated part when a substrate on which the laminated part having a plurality of functional elements is formed is cut and a semiconductor chip. In the method, a laser beam (L) is radiated onto the rear surface (4b) of the substrate (4) in the form of a laser beam plane of incidence in the stamped state of a protective tape (22) on the front surface (16a) of the laminated part (16) to form a reformed area (7) in the substrate (4) along a predetermined cut line so as to develop a crack (24) starting at the front surface side end part (7a) of the reformed area (7) to the front surface (4a) of the substrate (4). Under the condition that the crack (24) is developed, an expand tape is stamped on the rear surface (4b) of the substrate (4) and expanded so that not only the substrate (4) but also the laminated part (16) on the predetermined cut line, namely, interlayer insulation films (17a) and (17b) can be accurately cut along the predetermined cut line.</p> |
