| 摘要 |
A method for affixing an adhesive tape to a semiconductor wafer and an apparatus using the same are provided to improve attachment accuracy of the adhesive tape in a state of keeping a uniform thickness of the adhesive tape by using a peeing point detection unit. A holding and supporting table holds and supports a semiconductor wafer(W). An adhesive tape supply unit(6) supplies an adhesive tape(T) to a surface of the semiconductor wafer that is held and supported by the holding and supporting table. An attaching unit(8) attaches the adhesive tape on the surface of the semiconductor wafer by pressing the adhesive tape with an attaching roller(23). A peeing point detection unit detects a peeling point(p) of a separator on a supply path of the adhesive tape. A peeling recovery controller(37) controls a recovery bobbin of the separator based on detection data of the peeing point detection unit to perform a position control of the peeling point. |
