| 摘要 |
<p>Provided is a radiation-sensitive positive resin composition which is excellent in sensitivity, resolution and adhesion to a substrate, is developed to form clear apertures without residues, does not contaminate a plating solution, is capable of forming a resin film (resist) which is resistant to cracks after plating, resistant to indentation by plating, and resistant to lifting. A radiation-sensitive positive resin composition comprises a polymer(A) which has at least one end terminated with -SR (wherein R is a linear or branched alkyl group of 1 to 20 carbon atoms, a cyclic alkyl group of 3 to 20 carbon atoms, or a derivative thereof) and includes a structural unit having an acid-dissociative functional group which is dissociated by an acid to yield an acidic functional group; a radiation-sensitive acid generator(B); and an organic solvent(C). The polymer(A) is obtained using a chain transfer agent represented by the formula of R-SR, in which R is a linear or branched alkyl group of 1 to 20 carbon atoms, a cyclic alkyl group of 3 to 20 carbon atoms, or a derivative thereof.</p> |
