| 摘要 |
<p>This invention provides a plating material characterized in that the plating material comprises a layer (A) to be electrolessly plated, the surface roughness of the layer (A) is less than 0.5 Vm in terms of arithmetical mean roughness Ra as measured at a cutoff value of 0.002 mm, the 90-degree peel adhesion of the layer (A) is not more than 1.0 N/25 mm, and the layer (A) contains a polyimide resin. There is also provided a plating material characterized in that the plating material comprises a layer (A) to be electrolessly plated, the layer (A) contains a resin, and the tensile modulus of elasticity of a sheet formed of the layer (A) is not more than 1.8 GPa. According to the plating material, even when the surface roughness of the material surface is small, the adhesion between the material surface and an electrolessly plated film formed on the material surface is excellent, and, further, a good electroless plating can be formed over the whole area of the surface. Accordingly, the plating material is suitable for use, for example, in the production of printed wiring boards. A polyamic acid solution used in the plating material, a polyimide resin solution, and a printed wiring board using them are also provided.</p> |
