| 摘要 |
A piezoelectric device wherein planar sizes can be easily reduced and TAB tape resonance designing is easily performed. Further, a sealing hole can be surely sealed in the piezoelectric device. The piezoelectric device (10) has an IC chip (14) mounted on an inner bottom plane of a package, and a piezoelectric vibration piece (16) is electrically and mechanically connected on the TAB tape (32), which is provided with a lead on a surface of a resin tape. The TAB tape (32) whereupon the piezoelectric vibration piece (16) is bonded is mounted inside the package, and the piezoelectric vibration piece (16) is arranged on an upper part of the IC chip (14). |
