EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

Disclosed is an epoxy resin composition for semiconductor encapsulation which exhibits high flame retardance without using a flame retardance-imparting agent, while having excellent solder reflow resistance. Also disclosed is a semiconductor device obtained by sealing a semiconductor element using such an epoxy resin composition. The epoxy resin compositions for semiconductor encapsulation of first, second and third aspects are characterized by containing (A) a phenolaralkyl-type epoxy resin having a phenylene skeleton, (B) a phenolaralkyl-type phenol resin having a biphenylene skeleton, and (D) an inorganic filler as the common essential components. The epoxy resin compositions are further characterized in that the inorganic filler (D) is contained in an amount of 84-92% by weight of the total epoxy resin composition.