发明名称 |
CIRCUIT INTEGRE EN HYPERFREQUENCES COMPRENANT UNE PASTILLE SEMICONDUCTRICE |
摘要 |
<p>A microwave integrated circuit, includes: a dielectric substrate having a signal line on a front surface of the dielectric substrate and a mount pad disposed adjacent to an end of the signal line in a longitudinal direction of the signal line; a semiconductor chip having an upper electrode and a lower electrode provided on opposite surfaces of the semiconductor chip, the lower electrode being mounted on the mount pad; a bonding block connecting a bottom surface of the bonding block to the end in the longitudinal direction of the signal line; and a wiring member configured to bond the upper electrode of the semiconductor chip and a top surface of the bonding block together.</p> |
申请公布号 |
FR2837983(B1) |
申请公布日期 |
2007.08.24 |
申请号 |
FR20030003083 |
申请日期 |
2003.03.13 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KOJIMA HARUO;KITANI TOMOYUKI |
分类号 |
H01L23/12;H01L23/50;H01L21/822;H01L23/14;H01L23/66;H01L27/04;H01P1/18;H01P5/08;H03F3/60 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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