| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a system and a method for uniformly heating a wafer substrate. <P>SOLUTION: The invention are a system and a method for uniformly heating a wafer substrate arranged on a wafer carrier used for a wafer processing system such as a chemical deposition reaction device. The first pattern of a wafer compartment, for example, one of wafer carriers or a plurality of lings are provided on the surface of the wafer carrier. The second pattern of an insertion material different from the material of the wafer carrier is inserted in the bottom surface of the wafer carrier. The second pattern of the insertion material and the first pattern of the wafer compartment have a substantially complementary relationship. As a result, material contact surfaces more than those in a wafer support region having at least wafer and the wafer compartment exist in an intermediate region where there is no wafer compartment. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
