| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device, a method of manufacture thereof, a circuit board and an electronic device, in which the boards are electrically connected each other through a simple structure. <P>SOLUTION: The semiconductor device has first and second substrates 10, 20 disposed so as to be overlaid, and a semiconductor chip 30 mounted on each of the first and second substrates 10, 20. A first interconnect pattern 12 formed on the first substrate 10 has bent portions 16 which project from the surface of the first substrate 10. The bent portions 16 are bonded to a flat portion 26 of a second interconnect pattern 22 formed on the second substrate 20. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
