| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiband filter module whose element yield has been improved by reducing a coupling phenomenon by distributing output pads that have been densely crowded on a substrate. SOLUTION: In this multiband filter module, at least one top edge filter is laminated on the upper surface of a primary substrate, and then a primary packaging substrate packages the top edge filter laminated on the primary substrate. Meanwhile, at least one bottom edge filter is laminated on the upper surface of a secondary substrate, and then a secondary packaging substrate packages the bottom edge filter laminated on the secondary substrate. The two packaging substrates are combined so that the bottom surface of the primary substrate and that of the secondary substrate may face each other. COPYRIGHT: (C)2007,JPO&INPIT |
