| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection device and an inspection method of a semiconductor chip which do not take a lot of troubles with transfer operation and are free from chip flaw and crack fault due to handling. SOLUTION: The inspection device 101 of a semiconductor chip has a first probe 27 and a second probe 104 for applying an electrical signal to an LD chip 3a, and an optical detector 13 for detecting projection light 15 projected by the LD chip 3a. In the inspection device 101 of a semiconductor chip, a prescribed electrical signal is applied to the LD chip 3a and judgement or discrimination of defective or non-defective structure is carried out by detecting the projection light 15. It has a tilting stage 102 as a chip tilting means for tilting the LD chip 3a by a prescribed angleΘ, and a vertical movement mechanism 103 for moving the tilting stage 102 up and down. COPYRIGHT: (C)2007,JPO&INPIT
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