| 发明名称 |
Sealing compositions |
| 摘要 |
The present invention is a composition that may be used for sealing applications in the manufacture of electronic devices. The composition includes organic vehicles that may be removed upon low temperature firing in air or inert atmospheres. The present invention is further a process for the use of the composition.
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| 申请公布号 |
US2007194687(A1) |
申请公布日期 |
2007.08.23 |
| 申请号 |
US20050233804 |
申请日期 |
2005.09.23 |
| 申请人 |
WILCZEK LECH;GETTY ROSS;LYNCH PHILLIP B |
发明人 |
WILCZEK LECH;GETTY ROSS;LYNCH PHILLIP B. |
| 分类号 |
H01J63/04;H01J9/26;H01J9/32 |
主分类号 |
H01J63/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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