| 摘要 |
The resin layer formation method comprises the step of forming on a substrate 10 a resin layer 34 for containing a substance for decreasing the thermal expansion coefficient to thereby forming a resin layer 34 having said substance localized in the side thereof nearer to the substrate 10 ; and the step of cutting the surface of the resin layer 34 with a cutting tool 40 to planarize the surface of the resin layer 34 . The resin layer 34 as said substance for decreasing the thermal expansion coefficient localized in the side thereof nearer to the substrate 10 , and the surface of the resin layer 34 is cut to planarize the surface of the resin layer 34 , whereby the extreme abrasion and breakage of the cutting tool 40 by said substance for decreasing the thermal expansion coefficient can be prevented.
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