发明名称 |
Light emitting diode package |
摘要 |
A light emitting diode package. A package substrate has first and second electrode structures and a light emitting diode is mounted on the package substrate and electrically connected to the first and second electrode structures. A resin encapsulant is made of a transparent resin to seal the light emitting diode. A plurality of transparent spherical particles having a refractive index higher than the transparent resin are dispersed in the resin encapsulant.
|
申请公布号 |
US2007194341(A1) |
申请公布日期 |
2007.08.23 |
申请号 |
US20070709135 |
申请日期 |
2007.02.22 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHANG MYUNG WHUN;LEE JONG MYEON;CHOO HO SUNG;PARK YOUNG GON;LEE HAI SUNG |
分类号 |
H01L33/50;H01L33/54;H01L33/56;H01L33/62 |
主分类号 |
H01L33/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|