| 摘要 |
Wiring members such as bus bars for electrically connecting electronic components are contained in a casing composed of a substrate and a cover for closing an opening of the substrate. A laser beam is irradiated on and around solder held in one of the wiring members through a laser-transparent portion formed in the cover of the casing. The solder is melted by energy of the laser beam, and the wiring members are electrically connected by the molten solder. The electronic components and wiring members may be encapsulated in the casing before or after the laser beam is irradiated. Since the laser beam is irradiated from outside the casing after the electronic components and wiring members are contained in the casing, they can be positioned in the casing with greater freedom.
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